Lead Free Hot Air Reflow Oven

SMT N₂ Lead Free Hot Air Convection Solder Reflow System

規格 :

Specification ：

Overall dimensions ：4540（L）?1520（W）?1480（H）mm

Independence convection zone  : 16

Huge memory saving information bank with windows 98 program  

will provide the data analysis.

  Whole year production record and remarks, multi-function of graphic, printing or trouble-shooting?etc, which exhibit the high technology performance.

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Excellent on-line thermo-graph monitoring & analysis, data storage & setting ,convenience for production application.

Independently upper and lower-desk heating element systems with individually air force circulation control, specialized design for lead-free soldering technology.

Mini-circulation winding pipeline design, not only increasing the efficiency of heating element, and providing the accuracy of the temperature control in the head zones.

Auto-lubrication rail device，increase the reliability for both the chain & rail，resulting in the stable transmission and long life.

Double cooling zones designed will provide the sufficiency-cooling district, which without any thermo interference to the soldering zones, and ensure the production environment achieving standard ISO qualification.

The irregular temperature condition, fallen down PC board and not under control of nitrogen density, our alarming function ensure the properly production operation, to achieve the target of fully automation management.

The upper construction adopts electrical screw type lift-up device, convenience for the operators to take care the maintenance arrangement.

Mesh type transmission is suitable for mass and different kinds of PC boards production at the same time.

Urgent power supply protection device.